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Showing results: 31 - 35 of 35 items found.

  • High Power/Anti-Surge/High-Voltage Resistors

    ERJ-P Series - Panasonic Industrial Devices Sales Company of America

    Panasonic’s ERJ-P Series High Power Resistors offer the ability to use smaller case sizes while still maintaining the same level of power or better in respect to conventional size Thick Film Resistors. The ERJ-P Series has a unique trimming pattern and high heat dissipation characteristics. These parts can be easily designed as replacements for existing Thick Film Resistors due to comparable technology and materials with use of better manufacturing processes. The ERJ-P Series has an operating temperature of -55°C to 155°C, with a smaller part, you have a higher solder-joint reliability. Less material means less solder which lowers risk for solder fracture due to thermal expansion or contraction. Panasonic High Power Resistors are AEC-Q200 Qualified.

  • 3.5" Embedded SBC With Intel® Atom® Processor E3845/E3827, LVDS/VGA/HDMI, Dual LANs, Audio And ZIO

    CAPA840 - Axiomtek Co., Ltd.

    The CAPA840, a fanless 3.5-inch embedded single board computer, is based on the latest generation of Intel® Atom® processor E3845 or E3827 featuring 1.91/1.75GHz clock speed. Two DDR3L SO-DIMM slots support system memory up to 8 GB. Moreover, the fanless embedded board delivers better level of processing and graphics performance than previous generation Intel® Atom™ SBCs, while consuming less power. In addition to rich onboard I/Os, the CAPA840 adopts an ZIO connector on the rear-side that integrates PCIe x1, USB, LPC and SMbus expansion. With excellent thermal design, the 3.5” embedded board is able to run fanless and works smooth between -20°C to 70°C environments.

  • Computer-On-Module

    CM22301 - LinkedHope Intelligent Technologies Co.,Ltd.

    CM22301 uses Intel® sixth-generation Skylake platform and Core M low-power SoC processors, and integrates the full functions of CPU, GPU and South/North Bridge on a single chip. The processor provides powerful computing and display performance with dual-core and four threads configuration. Its turbo frequency can boost up to 3.1GHz and the display output resolution can be up to 4K. CM22301 has an amazing thermal design power consumption of only 4.5W (TDP) and can be used for a variety of high-performance fanless designs. CM22301 supports up to 16GB dual-channel low-voltage DDR3L memory populated onboard, and up to 64GB on-board solid state disk silicon, as benefit the development of ruggedized products for harsh environment applications.As defined by VITA 59 specification, CM22301 provides up to 6 PCIe lanes, enabling flexible functionality expansions, such as NICs, DAQs, video capture and so on. Meanwhile, CM22301 also provides up to date computer interfaces like GbE, SATA3, USB3.0/2.0, HD Audio, etc. CM22301 uses the same 220pin board-to-board connector and Type10 pin out definition as COM Express.

  • Rapid Temperature Change Test Chamber

    Sanwood Environmental Chambers Co ., Ltd.

    Sanwood is the company capable of offering a series of Rapid ESS Test Chamber,Rapid Temperature Change Test Chamber,Environmental stress screening (ESS) test chamber,Environmental stress screening test chamber,Temperature Change Test ChamberEnergy-saving design: Adopting PID + PWM principle of VRF (refrigerant flow control) technology to achieve low-temperature energy-saving operation (electronic expansion valve according to thermal energy conditions refrigerant flow servo control technology) low temperature working state, the heater does not participate in the work, through PID + The PWM regulates the flow rate and flow direction of the refrigerant, and regulates the three-way flow of the refrigerant pipe, the cold bypass pipe, and the hot bypass pipe to achieve automatic constant temperature to the working chamber. This method can reduce energy consumption by 30% under low temperature conditions.

  • OpenVPX CPU Blade with Intel® Xeon® D-1500 family Processor

    MIC-6315 - Advantech Co. Ltd.

    The MIC-6315 is the 6U OpenVPX processor blade echoing to the customer’s requirements. Based on the Intel® Xeon® D-1500 processor family, the MIC-6315 supports to 12 cores/24 threads, to fulfill the computing requirements form the customer. The MIC-6315 provides various high speed interfaces to communicate with the system: dual Serial Rapid I/O on the Data Plane, a configurable PCIe gen. 3 x 16 port on the Expansion Plane, with another x8 and x4 PCie ports on the user-define plane, and there are two 40GBase-KR4 ports available on the user-define plane. These interfaces enable the possibility of high speed data communication to optimize the performance of the product. Serial Rapid I/O and PCI express have low latency, scalable, error recoverable deterministic interconnectivity to the mainstream peripherals and I/O cards to create a system with vast functions. To maintain the maximum memory throughput in the different harsh environments, the Advantech R&D teams dedicate themselves to optimize the layout of the product. The MIC-6315 is capable to support ECC in a dual channel design running up to 2133MT/s with 64GB capacity*, and has the default capacity of the onboard DDR4 with 32GB or 16GB. The MIC-6315 offers three types of the storage options: A 64GB onboard NAND flash as the native storage, and three M.2 sites with 1x SATA M.2, 2x NVME M.2 interfaces are supported at the same time. The MIC-6315 has a reinforced convection-cooled heatsink as the thermal solution. Two native ruggedized connectors are available on the front panel, and several common I/O port connectors can be used for debugging purpose at the same time. Compliant with the IPMI 2.0, the MIC-6315 uses Adavantech-code-based board management solution, and supports iKVM, remote control and upgrade. This Advantech BMC code uses the LTS kernel for stability and security, and enables the possibility of customization. The user can setup the PCIe switch configuration in the BIOS menu without any firmware or hardware modification.

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